Semiconductor Industry

The semiconductor industry is an important part of the modern electronics industry, widely used in computer, communications, consumer electronics, automotive electronics and other fields, which plays a vital role in promoting technological progress. Silicon is a hard and brittle material with Mohs hardness of 6.5, which is the most basic and most critical material in the semiconductor industry and shows a wide range of applications in this area. However, a series of processes such as rod cutting, wafer thinning, and slicing are required before silicon used in the semiconductor industry. In addition, the hard brittleness of silicon and the high requirements of the semiconductor industry present a challenge for the precision machining of silicon material. Superhard materials, especially diamond, are widely used in precision machining of semiconductors, mobile phones, 3C materials and biomedical fields due to their excellent hardness and durability. At present, diamond and the tools made of diamond can be used in many processing processes of semiconductor silicon, playing a pivotal role.

Applications

In the semiconductor industry, semiconductor silicon wafers typically undergo the following processing processes: rod cutting, rod rounding, slicing, wafer chamfering and edging, wafer grinding, wafer thinning and polishing, and scribing. Diamond tools which are made with diamond abrasives such as single crystalline diamond and polycrystalline diamond, as well as diamond micron powder as raw materials can be applied to all of the above processing processes.

• Silicon rod cutting: According to different requirements, diamond circular saw blades with a diameter of 200-600 mm or electroplated diamond band saw blades with a thickness of 0.5-1 mm are frequently used in cutting silicon rods.
• Silicon rod rounding: The silicon rod after cut is not a regular cylindrical shape, which needs to be rounded by electroplated or sintered diamond grinding wheel to achieve the required diameter.
• Silicon rod slicing: At present, diamond circular saw blades with a diameter of 200-600 mm or diamond wire saw with a line diameter of 0.33-0.37mm are used to cut silicon rods into silicon wafers.

• Silicon wafer grinding: Slicing may damage the silicon wafer surface. To improve the silicon wafer surface quality and remove the surface damage layer, diamond grinding wheels are used to rough and fine grind the silicon wafer.
• Silicon wafer thinning and polishing: The thickness and roughness of silicon wafer are required. Therefore, under the premise of ensuring that the wafer has a certain strength, it is necessary to control the silicon wafer thickness and surfaces moothness. Wafer thinning can be performed with diamond grinding wheels, while silicon wafer polishing can be performed with diamond slurry & suspension.
• Scribing: Scribing is very important in the entire processing process. Diamond ultra-thin cut sheets can be used for this process.

Meet Alfa Chemistry

At Alfa Chemistry, we are committed to providing the highest quality superhard materials and services to meet the needs of semiconductor industry. We have successfully developed various diamond products including single crystalline diamond, polycrystalline diamond, diamond micron powder, resin bond diamond, diamond slurry & suspensions, diamond paste and many others. These products and the tools made by them have great application potential in the semiconductor industry and are suitable for the various processing process of silicon wafers. With our advanced products and unparalleled expertise, we are confident that we can provide superior diamond products solution for the semiconductor industry and help our customers gain a competitive advantage in the market with higher product performance and lower production costs to achieve their goals.