Diamond Slurries For Specific Applications
Inquiry
To meet specific needs of our customer, Alfa Chemistry has developed several application-specific diamond slurries. They are silicon carbide wafer multi-wire cutting slurry, silicon carbide lapping slurry, sapphire lapping slurry, metal processing lapping slurry and metallographic analysis polishing slurry. The details of these products are as follows:
1. Silicon Carbide Wafer Multi-wire Cutting Slurry
| Order Code | Particle Size | Abrasive Type | Density | Properties |
| DDS-5 | D50=4-6μm | Mono diamond | 0.9-1.1 g/cm3 | Alcohol-based carrier, oil-based carrier |
| DDS-6 | D50=7-12μm | Mono diamond | 0.9-1.1 g/cm3 | Alcohol-based carrier, oil-based carrier |
Show All
This product is mainly used for multi-wire cutting of silicon carbide crystals.
- Product characteristics
-
Good adhesion to the cutting line during the cutting process.
-
High cutting efficiency.
-
Good anti-rust performance.
-
Alcohol-based cutting slurry is more environmentally friendly and easy to clean.
-
Good suspension of diamond abrasive.
-
Strict quality control to ensure the consistency and stability of product.
2. Silicon Carbide Lapping Slurry (Roughly lapping)
| Order Code | Particle Size | Abrasive Type | Properties |
| DDS-7 | D50=2-4μm | Monodiamond | Stable suspension, water-based carrier |
Show All
This product is mainly used for coarse grinding and thinning of silicon carbide wafers.
- Product characteristics
- Achieve high material removal rate while ensuring the quality of silicon carbide wafer, when matched with cast iron plate.
- Good anti-rust performance.
- Stable diamond suspension, long-term placement without obvious settling phenomenon.
- Strict quality control to ensure the consistency and stability of product.
3. Silicon Carbide Lapping Slurry (Fine lapping)
| Order Code | Particle Size | Abrasive Type | Properties |
| DDS-8 | D50=2-4μm | Polycrystalline-like diamond | Stable suspension, water-based carrier |
| DDS-9 | D50=0-1μm | Polycrystalline-like diamond | Stable suspension, water-based carrier |
| DDS-10 | D50=0.2μm | Polycrystalline-like diamond | Stable suspension, water-based carrier |
Show All
This product is mainly used for lapping and polishing of silicon carbide wafers.
- Product characteristics
- Products matched with special silicon carbide grinding pad to achieve high removal rate and improved grinding efficiency.
- Achieving high surface quality of the silicon carbide wafer by using the products.
- Water-soluble carrier formula with good cleaning performance.
- Stable suspension.
- Better lubrication performance than conventional water-based formulations.
4. Sapphire Lapping Slurry
| Order Code | Particle Size | Abrasive Type | Properties |
| DDS-11 | D50=4-6μm | Polycrystalline-like diamond | Easy to shake, alcohol-based carrier, oil-based carrier |
| DDS-12 | D50=30-40μm | Polycrystalline-like diamond | Easy to shake, alcohol-based carrier |
Show All
This product is mainly used for thinning of super hard materials such as sapphire substrate.
- Product characteristics
- Achieving high removal rate of sapphire wafer and ensuring the surface quality of wafer, when matched with resin copper plate.
- Good cleaning performance and more environmentally friendly.
- Strict quality control to ensure the consistency and stability of product.
5. Metal Processing Lapping Slurry
| Order Code | Particle Size | Abrasive Type | Properties |
| DDS-13 | D50=2.8-3.3μm | Single crystal diamond | Oil-based carrier, stable suspension |
| DDS-14 | D50=5.5-6.5μm | Single crystal diamond | Oil-based carrier, stable suspension |
Show All
This product is mainly used for polishing the metal material of piston ring den.
- Product characteristics
- High removal rate and low cost.
- Better cleaning performance than the general oily diamond slurry.
- Excellent lubrication performance.
- Strict quality control to ensure the consistency and stability of product.
6. Metallographic Analysis Polishing Slurry
| Order Code | Particle Size | Abrasive Type | Properties |
| DDS-15 | D50=2-4μm | Polycrystalline diamond | Stable suspension, water-based carrier |
| DDS-16 | D50=0.75-1.25μm | Polycrystalline diamond | Stable suspension, water-based carrier |
| DDS-17 | D50=0-0.5μm | Polycrystalline diamond | Stable suspension, water-based carrier |
Show All
This product is mainly used for metallographic processing.
- Product characteristics
- Matched with different lapping pads or polishing pads, the produced workpiece with higher cutting efficiency and surface quality.
- Stable suspension.
- Water-soluble carrier formula with good cleaning performance and more environmentally friendly.
- Better lubrication performance than ordinary water-based formulations.
- Strict quality control to ensure the consistency and stability of product.
Note: All the products can be tailor-made according to customers' special requirements.
Alfa Chemistry is the world's leading manufacturer and marketer of synthetic diamond, and we provide variouus high-quality diamond slurries for specific applications. You can choose the suitable product for your needs. In addition, all product formulations can be customized according to your needs. Contact us quickly and our technicians can offer their expertise to provide you with the most suitable solution.
Please kindly note that our products and services are for research use only.
